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1/13 xc6120 series highly accurate, ultra small, low power consumption voltage detector xc6120x272xx 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0123456 input voltage: v in (v) supply current: i ss (a) ta= 85 25 -40 general description the xc6120 series are highly precise, low power consumpt ion voltage detectors, manu factured using cmos and laser trimming technologies. with low power consumption and high accu racy, the series is suitable for precision mobile equipment. the xc6120 in ultra small packages are ideally suited for high-den sity mounting. the xc6120 is available in both cmos and n-channel open drain output configurations. a pplications ? microprocessor reset circuitry ? memory battery back-up circuits ? power-on reset circuits ? power failure detection ? system battery life and charge voltage monitors typical application circuit ? typical performance characteristics ? supply current vs. input voltage etr0209-004 features highly accurate : 2% (v df(t) ? 1.5v) ???????????? : 30mv (v df(t) <1.5v) low power consumption : 0.6 a (typ.) [v df(t) =2.7v, v in 2.97v] detect voltage range : 1.0v ~ 5.0v in 0.1v increments operating voltage range : 0.7v ~ 6.0v detect voltage temperature characteristics : ? 100ppm/ ? (typ.) output configuration : cmos (xc6120c) : n-channel open drain (xc6120n) operating temperature range : -40 ? ~85 ? ultra small packages : usp-3, ssot-24 supply current: iss ( a) (unused for the cmos out p ut p roducts )
2/13 xc6120 series designator description symbol description c : cmos output ? output configuration n : n-ch open drain output ?? detect voltage (v df ) 10~50 : for example 1.0v ? 1, ? 0 ? detect accuracy 2 : ? 2% h : usp-3 ? (1 reel=3,000 pcs) ? packages n : ssot-24 (sc-82) (1 reel=3,000 pcs) r : embossed tape, standard feed ? device orientation l : embossed tape, reverse feed pin number usp-3 ssot-24 pin name function 1 4 v in power input 3 2 v ss ground 2 3 v out output - 1 nc no connection pin configuration pin assignment product classification ? ordering information xc6120 ?????? block diagrams (1) xc6120c (2) xc6120n ssot-24 (top view) usp-3 (bottom view) v ss v in v out v ss nc v in v out
3/13 xc6120 series input voltage range pull-up resistance 0.7v~6.0v ? 220k
0.8v~6.0v ? 100k
1.0v~6.0v ? 33k
parameter symbol rating units input voltage v in v ss -0.3~7.0 v output current i out 10 ma cmos output v ss -0.3~v in +0.3 output voltage n-ch open drain output v out v ss -0.3~7.0 v usp-3 120 power dissipation ssot-24 pd 150 mw operating temperature range ta -40~+85 ? storage temperature range tstg -55~+125 ? parameter symbol condition min. typ. max. units circuit operating voltage v in v df(t) =1.0 ? 5.0v (*1) 0.7 - 6.0 v - detect voltage v df v df(t) =1.0v ? 5.0v e-1 v ? hysteresis width v hys v df(t) =1.0v ? 5.0v v df 0.03 v df 0.05 v df 0.07 v ? supply current 1 i ss1 v in =v df(t) 1.1 e-2 a ? supply current 2 i ss2 v in = v df(t) 0.9v e-3 a ? v out =0.5v 0.09 0.57 - v out =0.3v 0.08 0.56 - i outn v in =0.7v v out =0.1v 0.05 0.30 - ma ? i outp (*2) v in =6.0v, v out =5.5v - -0.95 -0.60 ma xc6120c - 0.001 - output current i leak v in =6.0v, v out =6.0v xc6120n - 0.001 0.100 a ? temperature characteristics ? v df ? ta ~ v df -40 o c ? ta ? 85 o c - ? 100 - ppm/ o c ? detect delay time (*3) t df v in =6.0v 0.7v v in =v df to v out =0.5v - 30 100 s ? release delay time (*5) t dr v in =0.7v 6.0v v in =v dr to v out =v dr (*4) - 20 100 s ? a bsolute maximum ratings electrical characteristics ta = 2 5 ? xc6120 series *1: v df (t) : setting detect voltage *2: for xc6120c series only *3: a time taking from the time at v in = v df to the time at v out =0.5v when v in falls from 6.0v to 0.7v. *4: v dr : release voltage (v dr = v df + v hys ) *5: a time taking from the time at v in = v dr to the time at v out = v dr when v in rise from 0.7v to 6.0v. ta = 2 5 ? ? xc6120n series recommended pull-up resistance
4/13 xc6120 series symbol e-1 e-2 e-3 parameter setting detect voltage detect voltage v df (v) xc6120xxx2 series supply current 1 i ss1 ( a) supply current 2 i ss2 ( a) v df(t) min. max. typ. max. typ. max. 1.0 0.970 1.030 1.1 1.070 1.130 1.2 1.170 1.230 1.3 1.270 1.330 1.4 1.370 1.430 1.5 1.470 1.530 1.6 1.568 1.632 1.7 1.666 1.734 1.8 1.764 1.836 1.9 1.862 1.938 0.5 1.4 0.4 1.35 2.0 1.960 2.040 2.1 2.058 2.142 2.2 2.156 2.244 2.3 2.254 2.346 2.4 2.352 2.448 2.5 2.450 2.550 2.6 2.548 2.652 2.7 2.646 2.754 0.6 1.7 0.5 1.60 2.8 2.744 2.856 2.9 2.842 2.958 3.0 2.940 3.060 3.1 3.038 3.162 3.2 3.136 3.264 3.3 3.234 3.366 3.4 3.332 3.468 3.5 3.430 3.570 3.6 3.528 3.672 3.7 3.626 3.774 3.8 3.724 3.876 3.9 3.822 3.978 4.0 3.920 4.080 4.1 4.018 4.182 4.2 4.116 4.284 4.3 4.214 4.386 4.4 4.312 4.488 4.5 4.410 4.590 4.6 4.508 4.692 4.7 4.606 4.794 4.8 4.704 4.896 4.9 4.802 4.998 5.0 4.900 5.100 0.7 1.9 0.6 1.80 ? detect voltage accuracy and supply current specifications ( t 6 ) when setting detect voltage is 1.0v ? v df(t) ? 1.5v, detect accuracy is ? 30mv. when setting detect voltage is 1.5v ? v df(t) ? 5.0v, detect accuracy is ? 2%. electrical characteristics (continued)
5/13 xc6120 series test circuits circuit 1 circuit 2 circuit 3 circuit 4 r=100k
(unused for the cmos output products) measurement of waveform r=100k
(unused for the cmos output products)
6/13 xc6120 series operational explanation the following explains the operation of the typical applicat ion circuit along number symbols shown in the timing chart. ?? when input voltage (v in ) rises above detect voltage (v df ), output voltage (v out ) will be equal to input voltage (v in ). (a condition of high impedance exists with n-ch open drain output configurations.) ? ? when input voltage (v in ) falls below detect voltage (v df ), output voltage (v out ) will be equal to the ground voltage (v ss ) level. ?? when input voltage (v in ) falls to a level below that of the minimum operating voltage (v min ), output will become unstable. if in this condition, v in will equal the pulled-up output (shoul d output be pulled-up. ) (input voltage, v in , in the typical application circuit.) ? when input voltage (v in ) rises above the minimum operating voltage (v min ) level until it achieves a release voltage (v dr ), output keeps the ground voltage level (v ss ). ?? when the input voltage (v in ) rises above the release voltage (v dr ), output voltage (v out will be equal to input voltage (v in ). (a condition of high impedance exists with n-ch open drain output configurations.) ?? the difference between v dr and v df represents the hysteresis width. ? timing charge ? typical application circuit note: for explaining in a simplified case, an oper ation time of the circuit is not counted. v in v ss v out v in v out r (unused for the cmos output products) input voltage (v in ) output voltage (v out ) release voltage (v dr ) detect voltage (v df ) minimum operating voltage (v min ) ground voltage (v ss ) ground voltage (v ss ) ?
7/13 xc6120 series ?????????????????? [figure 1: circuit connected with the input resistor] ?? oscillation description [figure 2: oscillation caused by the input resistor of the cmos output product and the output current] note on use 1. please use this ic within the stated maximum ratings. oper ation beyond these limits may cause degrading or permanent damage to the device. 2. in order to stabilize the ic's operations, please ensure that v in pin's input frequency's rise and fall times are more than several s / v. 3. with a resistor connected between the v in pin and the power supply v dd some errors may be observed from the input voltage at the detect and release voltage. those errors are not constant because of the fluctuation of the supply current. 4. when a resistor is connected between the v in pin and the power supply v dd , oscillation may occur as a result of through current and voltage drop at the r in at the time of voltage release. (refer to t he oscillation description (1) below ) especially in the cmos output configur ations, oscillation may occur regardless of detect/release operation if load current (i out ) exists. (refer to the oscillation description (2) below) 5. please use n-ch open drains c onfiguration, when a resistor r in is connected between the v in pin and the power supply v dd power source. in such ca ses, please ensure that r in is less than 10k ? and that c is more than 0.1 f. (1) oscillation as a result of through current since the xc6120 series are cmos ics, trans ient through current will flow when the ic's internal circuit switching operates regardless of output configur ation. consequently, oscillation is liable to occu r as a result of the similar operations as in ( 1) above. this oscillation does not occur during the detect operation. (2) output current oscillation wi th the cmos output configuration as shown in figure 2, when the voltage applied at the power supply (v dd ) rises from below detect voltage to above release voltage, the ic commence release operat ions and the internal p-ch driver trans istor will be on. the output current (i out ) flows the input resistor (r in ) via the p-ch driver transistor. because of the input resistor (r in ) and the output current (i out ), an input pin voltage drops r in x i out . if the voltage drop level is larger than the ic?s hysteresis width (v hys ), the input pin voltage will falls below the v df and detect operations will commerce so that the internal p-ch driver tr ansistor will be off. the voltage drop will stop because the output current (i out ) which was flowing the p-ch driver transistor will run down. the input pin voltage will become the same voltage level as the input voltage (v in ). for this, the input pin voltage will rise above the release voltage (v dr ), therefore, the release oper ations will begin over again. oscillation may occu r with this repetition. further, this condition will also appear via means of a similar mechanism during detect operations. xc6120n xc6120c
8/13 xc6120 series typical performance characteristics (1) supply current vs. input voltage xc6120x102xx 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0123456 input voltage: v in (v) supply current: i ss (a) ta= 85 25 -40 xc6120x502xx 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0123456 input voltage: v in (v) supply current: i ss (a) ta= 85 25 -40 (2) output voltage vs. input voltage (3) detect voltage, release vo ltage vs. ambient temperature xc6120x102xx 0.90 0.95 1.00 1.05 1.10 1.15 1.20 -50 -25 0 25 50 75 100 ambient temperature: ta () detect voltage: v df (v) 0.90 0.95 1.00 1.05 1.10 1.15 1.20 release voltage: v dr (v) v dr v df xc6120x202xx 1.8 1.9 2.0 2.1 2.2 2.3 2.4 -50 -25 0 25 50 75 100 ambient temperature: ta () detect voltage: v df (v) 1.8 1.9 2.0 2.1 2.2 2.3 2.4 release voltage: v dr (v) v dr v df xc6120c202xx 0 1 2 3 4 5 6 0123456 input voltage: v in (v) output voltage: v out (v) ta= 25 xc6120n202xx 0 1 2 3 4 5 6 7 0.0 0.5 1.0 1.5 2.0 2.5 3.0 input voltage: v in (v) output voltage: v out (v) ta= 85 vpull-up=6v rpull-up=100k 25 -50
9/13 xc6120 series typical performance characteristics (continued) (4) output current (nch driver) vs. input voltage xc6120x502xx 0 2 4 6 8 10 0123456 input voltage: v in [v] output current(nch): i outn (ma) ta= -40 v out =0.5v 25 85 xc6120x502xx 0 2 4 6 8 10 0123456 input voltage: v in (v) output current(nch): i outn (ma) ta= -40 v out =0.3v 25 85 xc6120x502xx 0 1 2 3 4 5 6 0123456 input voltage: v in (v) output current(nch): i outn (ma) ta= -40 v out =0.1v 25 85 xc6120c102xx -1.50 -1.25 -1.00 -0.75 -0.50 -0.25 0.00 12 34 56 input voltage: v in (v) output current(pch): i outp (ma) ta= 85 25 -40 v out =v in -0.5v (5) output current (pch driver) vs. input voltage xc6120c102xx -1.00 -0.80 -0.60 -0.40 -0.20 0.00 123456 input voltage: v in (v) output current(pch): i outp (ma) ta= 85 25 -40 v out =v in -0.3v xc6120c102xx -0.30 -0.25 -0.20 -0.15 -0.10 -0.05 0.00 123456 input voltage: v in (v) output current(pch): i outp (ma) ta= 85 25 -40 v out =v in -0.1v
10/13 xc6120 series ?? ? ?t ? ? ?y ? ?? ?? ? ? ?? ??? ????? ? ?? ? ? ? ? ? ? ?? ????? ????? ?705 ?y ????? tz? ? ? ?????????? ? ? ??e ? ?e ????? ??? ??ye ??? ??e ???? ?t??? ? usp-3 ? ssot-24 packaging information ? usp-3 reference pattern layout * solder filet is not formed because of no plating at the lead side ? usp-3 reference metal mask design *thickness of solder paste 120 m recommended
11/13 xc6120 series mark output configuration output voltage product series k 1.0v ? 2.9v l cmos 3.0v ? 5.0v xc6120c m 1.0v ? 2.9v n nch open drain 3.0v ? 5.0v xc6120n mark detect voltage (v) mark detect voltage (v) 0 - 3.0 f 1.5 4.5 1 - 3.1 h 1.6 4.6 2 - 3.2 k 1.7 4.7 3 - 3.3 l 1.8 4.8 4 - 3.4 m 1.9 4.9 5 - 3.5 n 2.0 5.0 6 - 3.6 p 2.1 - 7 - 3.7 r 2.2 - 8 - 3.8 s 2.3 - 9 - 3.9 t 2.4 - a 1.0 4.0 u 2.5 - b 1.1 4.1 v 2.6 - c 1.2 4.2 x 2.7 - d 1.3 4.3 y 2.8 - e 1.4 4.4 z 2.9 - ? marking rule ? ssot-24 ?? represents output configurat ion and detect voltage range ?? represents detect voltage ??? represents production lot number 01 to 09, 10, 11, ? , 99, 0a, ? , 0z, 1a, ? repeated. (g, i, j, o, q, w excluded. reversed character is not used.) ssot-24 (top view)
12/13 xc6120 series mark product series 0 xc6120****** mark detect voltage (v) product series 3 x.3 xc6120**3*** 0 x.0 xc6120**0*** mark detect voltage (v) a 1.x b 2.x c 3.x d 4.x e 5.x mark detect voltage (v) f 1.x h 2.x k 3.x l 4.x m 5.x ? usp-3 ?? standard represents decimal point of detect voltage ?? standard represents output configuration a nd integer number of detect voltage ?? represents product series ? marking rule (continued) 1 2 3 3 usp-3 (top view) ? cmos output (xc6120c series) ? nch open drain (xc6120n series) ??? represents production lot number 01 to 09, 10, 11, ? , 99, 0a, ? , 0z, 1a, ? repeated. (g, i, j, o, q, w excepted.)
13/13 xc6120 series 1. the products and product specifications cont ained herein are subject to change without notice to improve performance characteristic s. consult us, or our representatives before use, to confirm that the inform ation in this catalog is up to date. 2. we assume no responsibility for any infri ngement of patents, pat ent rights, or other rights arising from the use of any info rmation and circuitry in this catalog. 3. please ensure suitable shipping controls (including fail-safe designs and aging protection) are in force for equipment employing products listed in this catalog. 4. the products in this catalog are not developed, designed, or approved for use with such equipment whose failure of malfunction ca n be reasonably expected to directly endanger the life of, or cause significant injury to, the user. (e.g. atomic energy; aerospace; transpor t; combustion and associated safety equipment thereof.) 5. please use the products listed in this catalog within the specified ranges. should you wish to use the products under conditions exceeding the specifications, please consult us or our representatives. 6. we assume no responsibility for damage or loss due to abnormal use. 7. all rights reserved. no part of this ca talog may be copied or reproduced without the prior permission of torex semiconductor ltd.

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